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Apple new 4 inch iPhone SE Teardown by Chipworks

A new 4 inch iPhone SE is the most powerful phone released in March 21st event 2016 which was the combination of iPhone 6S and iPhone 5S. Chipworks has posted the first teardown of the new 4-inch iPhone SE which reveals a mix of components from the iPhone 5s, iPhone 6, and iPhone 6s.

Chipworks has posted the first teardown of the new 4-inch iPhone SE which reveals a mix of components from the iPhone 5s, iPhone 6, and iPhone 6s

What’s similar to iPhone 6S and iPhone 5S
  • A9 appears to be the same flagship processor found in the iPhone 6s with APL1022 part number
  • SK Hynix memory, likely the same 2 GB LPDDR4 mobile DRAM found in the iPhone 6s
  • Broadcom BCM5976 and Texas Instruments 343S0645 that were also used back in the iPhone 5s
  • Driving the NFC is the NXP 66V10. The 66V10 contains two die, the Secure Element 008 and the NXP PN549
  • 6-axis inertial sensor (x, y, z, roll, pitch, and yaw) is an InvenSense 6-axis sensor
  • A throwback to the iPhone 6/6 Plus is the Qualcomm MDM9625M modem and the WTR1625L RF transceiver next to it.
  • Audio ICs are still the same 338S00105 and 338S1285 devices used in the iPhone 6s and iPhone 6S Plus.

What’s new in the iPhone SE:

  • Texas Instruments 338S00170 power management IC
  • Skyworks SKY77611 power amplifier module
  • Toshiba THGBX5G7D2KLDXG NAND flash and EPCOS D5255 antenna switch module
  • AAC Technologies 0DALM1 microphone
For more images and details, Read More
Apple new 4 inch iPhone SE Teardown by Chipworks Apple new 4 inch iPhone SE Teardown by Chipworks Reviewed by iMangoss on 7:34:00 PM Rating: 5

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